Dow Packaging Innovation Awards returns for its 2023 /2024 edition

Dow, a global leader in materials science, has announced the return of its highly anticipated Packaging Innovation Awards (PIA) for the 2023/2024 edition. As the packaging industry’s premier accolade, the PIA recognizes breakthroughs in technological advancement, sustainability, and enhanced user experience. This year, the awards will be held in the Asia-Pacific region for the first time, marking a significant milestone for the program.

With a history spanning 35 editions, the PIA has become one of the industry’s longest-running independently judged awards. It shines a spotlight on designs that showcase the potential of packaging when creativity and technology come together to solve contemporary challenges across the entire packaging value chain. In the previous edition, the PIA received over 180 packaging submissions from 30 countries, with 28 exceptional packaging solutions being recognized for their excellence.

The 2023/2024 edition introduces an enhanced biennial format, allowing participants a longer submission period to collaborate with relevant partners and build out their submissions. This format aims to provide an accessible platform for a greater pool of packaging professionals to have their most innovative designs judged on the world stage, further accelerating innovation in packaging. The submission period for the awards opens today and closes on March 8, 2024.

Karen S. Carter, President of Dow Packaging & Specialty Plastics, expressed excitement about the upcoming edition, stating, “Through the Packaging Innovation Award, we celebrate the best in packaging that meets protection, convenience, and performance needs while being designed for sustainability. We continue to be inspired by the level of creativity and problem-solving each award uncovers, and we are looking forward to what this next edition brings.”

David Luttenberger, the 2023 PIA Jury Chairperson and Global Packaging Director for Mintel Group Ltd., emphasized the significance of hosting the awards in the Asia-Pacific region. He highlighted the region’s role as the manufacturing hub of the world and the perfect setting to underscore the importance of packaging innovation and its impact on our lives today. Luttenberger also expressed his anticipation for more aspiring innovators to rise to the challenges faced by the packaging industry amidst ever-growing consumerism globally.

The Packaging Innovation Awards is open to all packaging professionals, and entry in the competition is free. Participants are not required to use Dow materials in their products. To be eligible, entries must be commercial products that have been on the market for more than six months by the submission deadline. The finalists for the awards will be notified on August 28, 2024, and the awards ceremony is scheduled to take place in Tokyo, Japan, in October 2024.

The Packaging Innovation Awards have been a prestigious competition in the packaging industry for over 30 years. It provides emerging up-and-comers and well-established brands with the opportunity to have their most innovative packaging judged on a global stage. Winning packages gain recognition among industry peers and exposure in new markets and with new audiences.

Dow, as a company, is committed to achieving profitable growth while delivering a sustainable future. With a portfolio of plastics, industrial intermediates, coatings, and silicones businesses, Dow offers a broad range of differentiated, science-based products and solutions for customers in high-growth market segments. The company operates manufacturing sites in 31 countries and employs approximately 37,800 people.

For more information about the Packaging Innovation Awards and to submit entries, visit the official website.